Step Action
1 In the Layout Designer, select Edit > Wafer Properties.
2 Type/select the following:

Wafer Dimensions tab

Length (μm): 100

Width (μm): 30

2D Wafer Properties tab

Material: cladding

3D Wafer Properties tab

Cladding

Material: cladding

Thickness: 0.1

Substrate

Material: cladding

Thickness: 30

3 Click OK to apply the layout settings.